Tantalum Target

Tantalum Target

Tantalum targets possess characteristics such as high purity, dense structure, and good sputtering stability, exhibiting stable performance under high vacuum and plasma environments. The thin films formed from tantalum targets exhibit strong adhesion, good uniformity, and high chemical stability, making them widely used in thin film deposition fields such as semiconductors, integrated circuits, display panels, and optical coatings.

Product Introduction

Our Tantalum Target

 

 

Dimension

Diameter 50-400mm X Thickness 3-28mm

Grade

R05200 R05400 R05252 (Ta-2.5W) R05255 (Ta-10W)

Purity

≥99.95% (Maximum 99.99%)

Recrystallize

Minimum 95%

Grain Size

Minimum 40um

Surface Roughness

Maximum Ra0.4

Flatness

0.1mm or maximum 0.10%

Tolerance

Diameter +/-0.254mm

 

Manufacturing Process – Electron Beam Vacuum Melting

 

 

We adopt Electron Beam Vacuum Melting (EB) as the core melting process for tantalum ingots.

Process Advantages:

● Ultra-high vacuum environment minimizes gas contamination

● Superior removal of oxygen, nitrogen, hydrogen, and metallic impurities

● Highly uniform microstructure and chemical composition

● Enhanced corrosion resistance and service life

● Excellent consistency between batches

This process is particularly critical for applications requiring high purity, long-term stability, and extreme corrosion resistance.

 

 

 

Quality Control

 

 

Mill Test Certificates (MTC) are provided for each shipment upon request.

  • Chemical composition analysis
  • Dimensional and surface inspection
  • Mechanical property testing
  • Batch traceability and documentation

 

 

 

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product-800-600

 

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